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VCSEL Chips & Arrays
   
 

GCS high speed 850nm multimode Vertical Cavity Surface Emitting Laser (VCSEL) chips are primarily designed for up to 400Gbps data communications and are specifically tailored for consumer-based active optical cable (AOC) and optical USB (OUSB) applications. This high performance device has high reliability and is engineered with low electrical parasitics. The VCSEL has a circular low divergence beam that can be efficiently coupled into a 50/125 or 62.5/125um multimode fiber. The device can also be arranged in linear 1x4, 1x8, or 1x12 arrays in a common cathode configuration, with 250m pitch between each channel, for up to 400Gbps applications.


VCSEL Key Features
  • 850nm multimode emission
  • Low threshold and operation current
  • Excellent reliability
  • Data rates up to 400 Gb/s for singlet chip
  • Optimized for -5C to 70C operation
  • High reliability with GCS robust 4” wafer manufacturing with fast cycle-time
  • Deliverable in GCS Known Good Die™ with 100% testing and inspection
  • Customized 1x4 array or other arrays layout available
  • RoHS compliant

Applications
  • Up to 400Gbps data communication
  • Active Optical Cable
  • Optical USB
  • HDMI


GaAs PIN VCSEL - Wavelength: 850nm

Part Number

Data Rate

Die Size (Single) (um x um)

Pad Design

Single/ Array

DO314B_VCSEL_8G 8Gbps (3dB BW: 7.5GHz) 250 x 250 Pitch = 250um P/N on top Singlet/ Array (1x4, 1x8, 1x12)
DO314_VCSEL_10G 10Gbps (3dB BW: 8.5GHz) 250 x 250 Pitch = 250um P/N on top Singlet/ Array (1x4, 1x8, 1x12)
DO385_VCSEL_25G 25Gbps (3dB BW: 18GHz) 210 x 210 Pitch = 250um P/N on top Singlet/ Array (1x4, 1x8, 1x12)
DO385_VCSEL_28G (PAM4) 28Gbps (3dB BW: 18GHz) 210 x 210 Pitch = 250um P/N on top Singlet/ Array (1x4, 1x8, 1x12)