• 2”, 3”, 4” GaAs, InP, GaN, and SiC wafer processing
• Stepper & Contact Photolithography
• Metal: Ti, Pt, Au, Au/Ge, Ni, TiW, Al, Ta, TaN, NiCr
  • E-beam evaporation & sputtering
  • Electro-plating for thick metals
  • Air-bridge process
• Dielectrics
  • SiNx, SiO2, Polyimide, BCB
• P/n-ohmic contacts (alloyed/non-alloyed)
• Schottky contacts
• Wet or dry mesa etch
• RIE or plasma dry etch
• Deep, vertical ICP dry etch