• 100% on-wafer Automated DC and RF Testing
  • DC (die sorting)
  • RF (up to 20 GHz): OIP3, harmonics, Oscillator, S-parameters, etc.
    
    
• Engineering Characterization Support (Up to 40 GHz)
  • Device Modeling (linear and non-linear models)
  • DC parametric test
  • RF small signal/large signal characterizations (load pull, OIP3, noise parameters etc.)
    
    
• Automatic Wafer Mapping With Ink or Inkless Electronic Wafer Mapping