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Testing Capabilities
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  Home > Pure-play Wafer Foundry > Foundry Services > Manufacturing Capabilities > Testing Capabilities
Testing Capabilities
  • 100% on-wafer Automated DC and RF Testing
    • DC (die sorting)
    • RF (up to 20 GHz): OIP3, harmonics, Oscillator, S-parameters, etc.

  • Engineering Characterization Support (Up to 40 GHz)
    • Device Modeling (linear and non-linear models)
    • DC parametric test
    • RF small signal/large signal characterizations (load pull, OIP3, noise parameters etc.)

  • Automatic Wafer Mapping With Ink or Inkless Electronic Wafer Mapping

testing capability