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  Home > Pure-play Wafer Foundry > Foundry Services > Manufacturing Capabilities > Processing Capabilities
 
Processing Capabilities
   
 
  • 2”, 3”, 4” GaAs, InP, GaN, and SiC wafer processing
  • Stepper & Contact Photolithography
  • Metal: Ti, Pt, Au, Au/Ge, Ni, TiW, Al, Ta, TaN, NiCr
    • E-beam evaporation & sputtering
    • Electro-plating for thick metals
    • Air-bridge process
  • Dielectrics
    • SiNx, SiO2, Polyimide, BCB
  • P/n-ohmic contacts (alloyed/non-alloyed)
  • Schottky contacts
  • Wet or dry mesa etch
  • RIE or plasma dry etch
  • Deep, vertical ICP dry etch